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[原创] Renesas RE01 Group系列32位ARM MCU开发方案

关键词:Arm Cortex- M0+ MCU 可穿戴设备 家用电器

时间:2019-11-11 13:21:27       来源:中电网

Renesas公司的RE01 Group系列是采用创新的SOTB™工艺,具有超低的工作电流和超低的待机电流,低压1.2V时具有高工作频率,最大64MHz.器件集成了32位Arm® Cortex®-M0+ mcu,1.5MB闪存,256KB SRAM,能量收获控制电路,MIP LCD控制器,2D图像引擎,14位超低功耗ADC,基准电压发生电路,RTC,次时钟修正电路,安全功能(可选),USB 2.0全速模块,SPI和quad SP.主要用在可穿戴设备,家用电器,建筑物自动化,工业传感器设备,智能锁,资产跟踪器和其它应用.本文介绍了RE01 Group主要特性,Cortex-M0+ CPU 框图,RE01 Group框图以及评估板RE01 1500KB主要特性和指标与MIP-LCD扩展板指标,主板布局图和MIP-LCD扩展板布局图,以及主板电路图和MIP-LCD扩展板电路图.

The RE01 Group uses Renesas’ innovative SOTB™ process technology and realizes both ultra-low active current and ultra-low standby current, and high-speed operation (maximum 64MHz) at low voltage (1.62V), which is impossible with a conventional bulk transistor, and is an embedded controller that can operate by energy harvesting. It is equipped with an energy harvesting control circuit, ultra-low power consumption 14-bit ADC (approx. 4uA), flash (rewrite at less than 1mA), parallel MIP-LCD interface, 2D graphics, UI for clock movement, and security functions such as a trusted secure IP. It also has large-capacity 1.5MB flash and 256KB SRAM that can handle data logging and firmware updates. Therefore, the RE01 Group is suitable for wearable devices, home appliances, building automation, industrial sensor devices, smart locks, asset trackers, and other applications.

RE01 GroupCPU

 Arm® Cortex-M0+
- Revision: r0p1-00rel0
- Arm®v6-M architecture profile
- Single-cycle integer multiplier
 Memory Protection Units (MPU)
- Arm®v6 Protected Memory System Architecture
- Eight protected regions
 SysTick timer
- Driven by LOCO clock (32.768 kHz ± 30%)

图1.Cortex-M0+ CPU 框图

Debug

 Arm® CoreSight™ MTB-M0+
- Revision: r0p1-00rel0
- Buffer size: 32-Kbyte MTB RAM
 Data Watchpoint Unit (DWT)
- Two comparators for watchpoints
 Breakpoint Unit (BPU)
- Four instruction comparators
 CoreSight Debug Access Port (DAP)
- Serial Wire Debug Port (SW-DP)
 Debug Register Module (DBGREG)
- Reset control
- Stop control
Operating frequency
 CPU core: maximum 64 MHz
 Serial Wire Data (SWD) interface: maximum 12.5 MHz

RE01 Group主要特性:

■ Arm® Cortex®-M0+ core incorporated
 Maximum operating frequency: 64 MHz (boost mode)
 ARM® Memory Protection Unit (MPU)
 CoreSight™ debug port: SW-DP
■ Power-saving functions
 Back-bias control function based on silicon-on-thin-buried-oxide(SOTB™) process technology
 Operation at ultra-low power-supply voltages (from 1.62 V to 3.6 V)
 Four power control modes based on the operating frequency
 Four low power consumption modes
 Three power supply modes
■ On-chip code flash memory
 1.5-Mbyte code flash memory
 Background programming/erasing
 No cycles of waiting for access in operation at or below 32 MHz;one cycle of waiting at frequencies above 32 MHz
 Function for area protection prevents erroneous overwriting ortampering
■ On-chip SRAM
 256-Kbyte SRAM with no access wait cycles
■ Data transfer
 Four DMA controllers
 Single data transfer controller (DTC)
■ Reset and supply management
 Power-on reset circuit (POR)
 Low voltage detection (LVD) can be set.
■ Multiple clock sources
 External crystal oscillator (main clock): 8 to 32 MHz
 External crystal oscillator (sub-clock): 32.768 kHz
 High-speed on-chip oscillator (HOCO): 24, 32, 48, or 64 MHz
 Middle-speed on-chip oscillator (MOCO): 2 MHz
 Low-speed on-chip oscillator (LOCO): 32 kHz
 Independent watchdog timer on-chip oscillator: 16 kHz
 PLL frequency synthesizer
■ Energy harvesting control
 A power generation element is directly connectable.
 High-speed startup is possible without having to wait for the chargingof a secondary battery.
 Function to prevent a secondary battery from overcharging
■ Independent watchdog timer
 14-bit counter, 16-kHz (1/2 LOCO clock frequency) operation
■ Sub-clock correction circuit (CCC)
 The CCC corrects the accuracy of oscillation every 16 seconds(theoretical regulation).
 Events can be generated per second in deep software standby mode.
■ Communication functions
 Single USB 2.0 full-speed host/function module with PHY layer
 Two serial peripheral interfaces
Single 128-bit buffer for which up to eight commands can be specified
Single 32-bit buffer for which one command can be specified
 Single quad serial peripheral interface connectable to an external flashmemory
 Two I2C bus interfaces
 Five serial communications interfaces (SCIg)
Asynchronous, clock-synchronous, simple I2C, simple SPI, and smart
card interfaces, and IrDA interface version 1.0 (the latter is onlyapplicable to SCI0)
 Two serial communication interfaces (SCIi) each having a 16-byteFIFO
■ Various analog circuits
 Single 14-bit successive approximation A/D converterHigh precision: 7 channels, standard precision: 11 channels
 Single 12-bit D/A converter with a buffer amplifier
 Single analog comparator (ACMP)
 Single temperature sensor for measuring the internal temperature of thechip
 Reference voltage generation circuit for the 14-bit A/D converter
 Single motor driver control circuit (MTDV)
The MTDV can drive up to three motors.
 Single constant current (1 mA or 0.5 mA) source circuit with threechannels that can drive three external LEDs
■ Various timer circuits
 Six general PWM timers (GPT)
Two 32-bit counters
Four 16-bit counters
 Two asynchronous general-purpose timers (AGT) that can be used instandby mode
 Two 8-bit timers (TMR)
 Single realtime clock (RTC)
 Single watchdog timer (WDT)
 Single low-speed timer (LST) that operates at 1 kHz
A circuit for converting hexadecimal numbers to decimal numbers foruse as a stopwatch
 Single low-speed pulse generator (LPG)
Pulse output at two frequencies (2.048 or 4.096 kHz) is possible.
■ Human machine interfaces
 Single memory-in-pixel (MIP) LCD controller (MLCD)Parallel interface is supported.
 Single 2D graphics data conversion circuit (GDT)
■ Security functions (optional)
 Single Trusted Secure IP Lite (TSIP)
· AES (128- or 256-bit key length, supporting ECB, CBC, CMAC,GCM, and others)
· Key wrapping protects against the leakage of the encryption keysof users.
· An access management circuit disables illicit access to theencryption engine.
· Using the other security functions together with area protectionenables secure booting and secure over-the-air (OTA) softwareupdates.
■ Operating voltage and temperature range
 VCC = IOVCC = 1.62 V to 3.6 V
IOVCCn and AVCCn can each be independently set to a voltagewithin the range between 1.62 V and 3.6 V.
 Ta: –40 to +85 ℃

RE01 Group主要应用:

The RE01 group enables energy harvesting for any IoT device, eliminating the need for battery replacement / maintenance. SOTB-powered ultra-low power 32-bit CPU realizes smart IoT devices powered by an even tiny ambient power source.

图2.RE01 Group框图

评估板RE01 1500KB

Evaluation Kit RE01 1500KB allows for evaluation and development by combining energy harvesting with the user’s hardware system, which makes semi-permanent battery maintenance for the RE01 1500KB unnecessary.

图3.评估板RE01 1500KB外形图

评估板RE01 1500KB主要特性:

Energy harvesting system: can be evaluated with the power generation elements, the secondary battery connection interface, and the sample code provided by Renesas.*1

Arduino Uno Header and PMOD interface supported: enable evaluation of energy harvesting system combined with the user’s hardware system.

On-board debug function supported: enable program debugging by simply connecting the included USB cable to a host PC.

评估板RE01 1500KB包括:

Evaluation Board RE01 1500KB
PMOD-compatible low-power LCD (Memory-In-Pixel LCD) expansion board
Solar panel
USB cable (Micro-B)

评估板RE01 1500KB主要指标:

MIP-LCD扩展板指标:


图4.主板布局图

图5.MIP-LCD扩展板布局图

图6.主板正面元件放置图

图7.主板背面元件放置图

图8.内部板框图

图9.主板电路图(1)

图10.主板电路图(2)

图11.主板电路图(3)

图12.主板电路图(4)

图13.主板电路图(5)

图14.主板电路图(6)

图15.主板电路图(7)

图16.主板电路图(8)

图17.主板电路图(9)

图18.主板电路图(10)

图19.主板电路图(11)

MIP-LCD扩展板电路图
详情请见:


以及


r01ds0363ej0100-re01_1500kb.pdf
r20ut4379ej0100-ekre01-usermanual.pdf
r20ut4564ej0200_miplcd-schema.pdf
r20ut4563ej0300_ekre01_main-schema.pdf

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